About Us

Tensan thermal gel is a prominent player in the thermal conductive market. It features a high thermal conductivity coefficient, ensuring rapid heat transfer and better cooling than many alternatives. The curing process is flexible, yielding a stable and elastic gel post-curing, in contrast to some gels with strict curing demands. It exhibits excellent chemical and thermal stability over the long term, while some others falter in extreme conditions. The syringe packaging and automatic dispensing method allow for precise and efficient application, suitable for automated production lines, unlike traditional construction of certain gels. Environmentally friendly, it lacks harmful substances. Despite a mid-to-high price range, its superior performance and quality make it an ideal choice for electronics requiring efficient heat dissipation.

Tensan coating adhesive is a remarkable material. It shows outstanding bonding performance, firmly adhering to diverse materials like metals, plastics, and glass. The curing process is favorable, with a proper speed and less strict environmental demands compared to some adhesives. Its temperature resistance is broad, remaining stable from low to high temperatures. The insulation property is excellent, safeguarding electronic components. Chemically, it withstands various substances well. Environmentally, it contains no harmful elements like heavy metals and halogens. Overall, Tensan coating adhesive outperforms many others in multiple aspects, providing a reliable option for coating applications, though specific usage still requires considering actual working conditions.

Tensan thermal pads have outstanding performance in multiple aspects. In thermal conductivity, advanced technology enables efficient heat transfer, far better than ordinary pads. It has excellent insulation performance, preventing leakage and short circuits, while some ordinary pads have potential risks. It has a wide temperature resistance range and remains stable at high temperatures, while ordinary pads are prone to aging and failure. With good flexibility, it can closely fit heat dissipation surfaces, while ordinary pads may have poor contact. Its compression and rebound performance is excellent, maintaining well after multiple compressions, while ordinary pads have a rapid decrease in rebound rate. Although Tensan thermal pads have obvious advantages, the actual selection still needs to be comprehensively considered according to equipment and working conditions, providing an important reference for material selection in the heat dissipation field.