About Us

Shenzhen Tensan Co., Ltd. was established in July 2014 in Shenzhen Special Economic Zone. 0ur company, as one of the high-tech company, is professional engaged in organic silicone and sizing program R&D, manufacturing, sales and service. The company’s main products are thermal potting, thermal grease, thermal pad, electronic silicone and sizing program. Our products are mainly applied in electronic appliances industry, home appliances industry, lighting industry, automobiles industry, photovoltaic industry, mobile phone industry. Owing to The Belt and Road strategy, our company vigorously implement opening strategy to expand the Belt and Road. Branches and office have been opened in Thailand, Vietnam, India, the Philippines. Service localizing to improve company service efficiency. Our company firmly adhere to the profession creates value to provide excellent services for domestic and foreign customers with all-round silicone use and solutions.
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Latest News

  • Thermal Paste's Thermal Conductivity and Correct Application Method alt=
    28/04/2026

    Thermal Paste's Thermal Conductivity and Correct Application Method

    Many people are unaware of the actual function of thermal paste: the contact surface between heat-generating components such as CPUs and chips and the heatsink is not perfectly flat; tiny gaps, barely perceptible to the naked eye, are filled with air, which has extremely poor thermal conductivity. Applying thermal paste between them perfectly fills these gaps, expelling air and creating an efficient heat conduction channel, allowing heat to be quickly conducted from the heat-generating component to the heatsink, fully utilizing the heat dissipation capacity of the heatsink.

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  • Core Performance Analysis of Electronic Potting Compounds alt=
    27/04/2026

    Core Performance Analysis of Electronic Potting Compounds

    For high-quality electronic potting compounds, thixotropy and weather resistance are two indispensable core properties, directly determining their performance, operational efficiency, and lifespan. They also need to be combined with other key properties to meet the encapsulation requirements of various electronic components.

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  • Proper Use of Thermal Pads alt=
    24/04/2026

    Proper Use of Thermal Pads

    Thermal pads (also known as thermally conductive silicone pads) are indispensable heat dissipation auxiliary components in electronic devices, primarily used to fill the gaps between electronic components and heat sinks or product casings. They possess excellent adhesion, flexibility, compressibility, and thermal conductivity, effectively expelling air between contact surfaces and ensuring full contact between electronic components and the heat dissipation structure, significantly improving equipment heat dissipation efficiency. While the operation of thermal pads is relatively simple, attention to detail is crucial; slight negligence can compromise their heat dissipation performance. The following details the correct use of thermal pads to help ensure standardized operation and optimal heat dissipation.

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